Polyimide 25µm FPC – 2-Layer 0.24mm Thick Flexible PCB with Immersion Gold for High-Frequency Applications
1.Revolutionize Your Flexible PCB Designs with Polyimide 25µm FPC
Polyimide 25µm FPC is a high-performance flexible printed circuit board designed for high-frequency signal transmission and dynamic bending scenarios. With a dielectric constant (Dk) of 3.3 and a dissipation factor (Df) of 0.0019 at 10 GHz, this 2-layer flexible PCB is perfect for mobile phones, wearable devices, automotive electronics, and medical devices.
Featuring immersion gold surface finish, excellent flexibility, and superior thermal resistance, this FPC ensures reliable performance in harsh environments, making it the ideal choice for high-reliability flexible electronic devices.
2.Key Features of Polyimide 25µm FPC
Dielectric Constant (Dk): 3.3 at 10 GHz
Dissipation Factor (Df): 0.0019 at 10 GHz
Peel Strength: ≥1 N/mm
Moisture Absorption: ≤1.5%
Halogen-Free & Flame Retardant: Meets UL94 V-0 standards
Excellent Flexibility & Thermal Resistance: Ideal for dynamic bending and high-temperature environments.
3.Product Advantages
- High Frequency and Flexibility：Break through the high-frequency performance bottleneck of traditional FPCs, supporting millimeter-wave and high-speed data transmission.
- Extraordinary Long Lifespan：The dynamic bending performance is superior to industry standards, ensuring the reliability of folding devices.
- Resistant to Harsh Environments：Passed a number of reliability tests such as high-temperature and high-humidity (double 85), and thermal shock (-40°C to 125°C).
- Cost Optimization：It has a higher cost-performance ratio compared to similar imported products (such as DuPont Pyralux AP), and the local supply chain offers a rapid response.
4.PCB Stackup: 2-layer flexible PCB
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 μm |
| Adhesive | 20 μm |
| SF305 Polyimide Core | 0.025 mm (25 μm) |
| Adhesive | 20 μm |
| Copper Layer 2 | 35 μm |
5.PCB Construction details:
| Parameter | Specification |
|---|---|
| Board Dimensions | 75mm x 62mm = 1PCS, ±0.15mm |
| Minimum Trace/Space | 14/16 mils |
| Minimum Hole Size | 0.5mm |
| Blind Vias | No |
| Finished Board Thickness | 0.24mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Yellow |
| Bottom Solder Mask | Yellow |
| Electrical Test | 100% tested prior to shipment |
6.PCB Statistics:
Components: 2
Total Pads: 14
Thru Hole Pads: 12
Top SMT Pads: 2
Bottom SMT Pads: 0
Vias: 0
Nets: 2
7.Type of artwork supplied: Gerber RS-274-X
8.Quality standard: IPC-Class-2
9.Availability: worldwide
10.Applications of Polyimide 25µm FPC
- Computer
- Mobile phone,
- Digital camera, VCR,
- Automobile, Office Automatic equipment, etc..
11.Upgrade Your Flexible PCB Designs with Polyimide 25µm FPC!
Whether you're working on foldable smartphones, wearable tech, or automotive electronics, Polyimide 25µm FPC offers the perfect combination of flexibility, reliability, and high-frequency performance. With low dielectric loss, excellent bending resistance, and immersion gold finish, this FPC is the ideal choice for your next flexible PCB project.